High heat density
Supports processors and racks with concentrated thermal loads.
High-density thermal management
Liquid cooling for AI and HPC infrastructure.
Cold plates, coolant distribution units, immersion systems and heat exchangers for racks where air cooling alone is no longer sufficient.
- AI / HPChigh-density computing
- CDUcontrolled liquid loop
- Hybridair and liquid architectures
Coolnet solutionLiquid Coolingselection and integration
Technology for critical infrastructure
Move heat with liquid close to the source.
High-power processors create concentrated heat loads that can exceed the practical limits of conventional airflow. Liquid cooling transfers heat through cold plates or immersion fluids to a controlled facility loop.
A complete design includes the IT loop, CDU, water quality, pumps, redundancy, leak detection, heat rejection and the remaining air-cooling load.
Efficient heat transport
Liquid carries more heat with less volume than air.
Controlled separation
A CDU separates and regulates facility and technology loops.
System monitoring
Flow, temperature, pressure, leakage and alarms are supervised.
Solution families
Select the architecture for the actual application.
The final configuration is confirmed after reviewing capacity, installation conditions, required availability and future expansion.
Direct-to-chip
Cold Plate Cooling
Cooling plates remove heat directly from processors and other high-power components while the rest of the rack may remain air cooled.
- Targeted processor cooling
- Hybrid air/liquid operation
- Rack manifolds and flexible connections
- Monitoring of flow and temperature
Coolant distribution
CDU Systems
Coolant distribution units control temperature, pressure and flow while separating the technology loop from facility water.
- Heat exchanger and pumping module
- Facility/technology loop separation
- Redundant pump options by design
- Controls, alarms and communication
Immersion cooling
Immersion Systems
IT equipment is immersed in a dielectric fluid, providing direct heat transfer for very high-density applications.
- Single- or two-phase concepts depending on project
- High-density thermal capability
- Dedicated fluid and tank design
- Service procedures specific to immersion
Hybrid heat rejection
Air and Liquid Integration
Liquid-cooled racks still require coordinated room cooling, heat rejection and environmental control for residual loads.
- Residual air-load calculation
- Dry cooler or chilled-water integration
- Condensation prevention
- DCIM and facility monitoring
Applications
Infrastructure matched to the operating environment.
Equipment selection should reflect the consequences of downtime, site conditions, service strategy and the expected development of the IT load.
Describe your project →AI training
GPU clusters with concentrated rack power.
HPC
Compute-intensive scientific and engineering systems.
High-density Data Centers
Racks beyond conventional airflow capability.
Edge compute
Compact high-performance systems where space is limited.
Selection criteria
What should be confirmed before configuration?
- 01
IT hardware
Processor requirements, supported cold plates or immersion compatibility.
- 02
Thermal load
Rack power, liquid-cooled share and remaining air-cooling load.
- 03
Facility water
Supply temperatures, water quality, pressure and heat-rejection system.
- 04
Reliability
Pump redundancy, leak detection, controls, maintenance and emergency procedures.
Technical documentation
Coolnet liquid-cooling catalogs.
The 2027 brochures extend the existing documentation with complete CDU systems, immersion cooling, fluid distribution, RDHx and outdoor heat-rejection products.
Frequently asked questions
FAQ: Liquid Cooling
Does liquid cooling replace all air cooling?+
Not always. Many direct-to-chip systems are hybrid and retain air cooling for components not connected to the liquid loop.
What does a CDU do?+
It transfers heat and controls flow, temperature and pressure between the technology and facility loops.
Is chilled water required?+
The heat-rejection source depends on the design and operating temperatures; chilled water is one possible option.
How are leaks managed?+
The design should include suitable connectors, monitoring, leak detection, isolation and operating procedures.
When should liquid cooling be considered?+
When processor or rack density approaches airflow limits, or when energy and heat-reuse objectives justify it.
Request a consultation
Start with IT hardware, rack power and available facility-water conditions.
Send the available project data. We will identify the information required to prepare an appropriate configuration.